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Guide e Tutorial sul mondo della Stampa 3D.
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It uses an additive manufacturing process (aka 3D printing or direct write) that prints commercially-available conductive, dielectric, semiconductor and biologic inks onto a variety of 2D or 3D plastic, ceramic, and metallic substrates. The result is 3D printed electronics that eliminate the need for hard tooling photomasks or stencils and enable engineering changes to be quickly implemented by simply modifying the design file.

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Aerosol Jet technology enables 3D printed electronics. Electronic components such as resistors, capacitors, antennas, sensors, and thin film transistors have all been printed with Jet technology. The performance parameters of printed components, for example the ohm value of a resistor, can be controlled through printing parameters. Components can also be printed onto 3 dimensional surfaces eliminating the need for a separate substrate thereby reducing the size, thickness and weight of the end product. For example, Aerosol Jet is used to print antennas and sensors that conform to the shape of the underlying substrate such as a cell phone case.

The Aerosol Jet process supports printing on a wide variety of substrates including plastics, ceramics and metallic structures. Commercially available materials, such as nano-particle inks, have been optimized for the Aerosol Jet process to allow printing (and subsequent ink sintering) onto plastic substrates with low heat deflection temperatures. movers and packers vadodara

The idea of using 3d printing technology to manufacture electronics dates back to the early 20th century, but its use for volume manufacturing didn’t become prevalent until the 1950s. Back then, photo plotters were used to produce master artwork circuit patterns on a clear mylar or glass substrate. The master artwork circuit pattern was then transferred onto a copper clad laminate coated with positive photoresist material. When exposed to light, the photoresist not masked by the circuit pattern became soluble and could be washed away leaving just the desired circuit pattern covered in resist material. An etching process was then used to remove the exposed copper leaving the desired circuit pattern. After removing the remaining photoresist from the circuit pattern, holes were drilled into the board and plated for mounting electrical components such as resisters, capacitors, integrated circuits. A wave soldering process was used to electrically connect the components to the circuits completing the printed circuit board (PCB) manufacturing process.

More recently, other graphic printing technologies, such as ink jet and screen printing, have been used to fabricate printed circuit boards. All of these processes serve the electronics industry well, but have limitations. For example, with photo plotting, a new master artwork is required to implement design changes and the process is not environmentally friendly. And, since all of these processes were developed to print on paper – they can only be used to manufacture circuits on a flat surface.

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